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Global Standards for the Microelectronics Industry
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Flash Memory: SSDs, UFS, e.MMC
Main Memory: DDR3 & DDR4 SDRAM
3D-ICs
Memory Module Design File Registrations
Mobile Memory: LPDDR, Wide I/O, Memory MCP
Registered Outlines: JEP95
Memory Configurations: JESD21-C
Lead-Free Manufacturing
ESD: Electrostatic Discharge
Dictionary: JESD88
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ID Codes for Low Power Memories Order Form
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最热门JEDEC标准:中文描述
Document Translation
About JEDEC Standards
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JC-10: Terms, Definitions, and Symbols
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
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Year in Review: 2016
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Main menu
Standards & Documents
Search Standards & Documents
Technology Focus Areas
Flash Memory: SSDs, UFS, e.MMC
Main Memory: DDR3 & DDR4 SDRAM
3D-ICs
Memory Module Design File Registrations
Mobile Memory: LPDDR, Wide I/O, Memory MCP
Registered Outlines: JEP95
Memory Configurations: JESD21-C
Lead-Free Manufacturing
ESD: Electrostatic Discharge
Dictionary: JESD88
Introduction
Referenced Documents
Type Registration, Data Sheets
ID Codes Order Form
ID Codes for Low Power Memories Order Form
Copyright Information
最热门JEDEC标准:中文描述
Document Translation
About JEDEC Standards
Committees
All Committees
JC-10: Terms, Definitions, and Symbols
JC-11: Mechanical Standardization
JC-13: Government Liaison
JC-14: Quality and Reliability of Solid State Products
JC-15: Thermal Characterization Techniques for Semiconductor Packages
JC-16: Interface Technology
JC-40: Digital Logic
JC-42: Solid State Memories
JC-45: DRAM Modules
JC-63: Multiple Chip Packages
JC-64: Embedded Memory Storage & Removable Memory Cards
News
News
JEDEC Awards Program: 2017 Honorees
JEDEC Quality & Reliability Task Group in China
Media Kit
Events & Meetings
All Events & Meetings
ROCS Workshop (GaAs)
Server Forum
Server Forum Agenda
Mobile & IOT Forum Taiwan
Mobile & IOT Forum Korea
Automotive Electronics Forum
Memory Workshops: DDR5, NVDIMM-P, DRAM Tutorial
DDR4 Workshop: Presentations for Sale
ROCS Workshop: Papers for Sale
Career Center
Find a Job
Post a Job
More Job Resources
Join
Apply for JEDEC Membership
Membership Benefits
Membership Dues & Details
About
Overview
Activities
JEDEC History
Pre-1960s
1960s
1970s
1980s
1990s
2000s
2010s
Member List
Board of Directors
Committee Chairs
Policies & Governance
Patent Policy
Year in Review: 2016
Contact
Staff
RSS Feeds
Login required
Members Area
JC-42 Recent News
JEDEC Updates Standards for Low Power Memory Devices
Mar 2017
JEDEC DDR5 & NVDIMM-P Standards Under Development
Mar 2017
JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard
Jan 2016
JEDEC Announces Publication of GDDR5X Graphics Memory Standard
Jan 2016
JEDEC Updates Standards for Low Power Memory Devices
Nov 2015
HGST Engineer Receives JEDEC Outstanding Leadership Award
Jul 2015
JEDEC Publishes Wide I/O 2 Mobile DRAM Standard
Sep 2014
JEDEC Releases LPDDR4 Standard for Low Power Memory Devices
Aug 2014
JEDEC Presents Award of Excellence to Micron’s Dan Skinner
Jun 2014
JEDEC, TSIA and KSIA to Host Mobile Technology Conferences in Asia
Jun 2013
JEDEC Announces Publication of DDR4 Standard
Sep 2012
JEDEC Announces Publication of LPDDR3 Standard for Low Power Memory Devices
May 2012
JEDEC to Focus on Mobile Technology in Upcoming Conference
Mar 2012
JEDEC Publishes Breakthrough Standard for Wide I/O Mobile DRAM
Jan 2012
JEDEC to Host Mobile Memory Event at 2012 International CES
Nov 2011
JEDEC to Focus on Memory for Servers in Upcoming Event
Sep 2011
JEDEC Publishes New Standard for Serial NOR Flash
Sep 2011
JEDEC Announces Key Attributes of Upcoming DDR4 Standard
Aug 2011
JEDEC to Feature New Mobile Memory Standards in Event Series
May 2011
JEDEC Announces Broad Spectrum of 3D-IC Standards Development
Mar 2011
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