Global Standards for the Microelectronics Industry
Dictionary - Referenced Documents
| RS-308-A* | Preparation of Outline Drawings of Solid State Products for JEDEC Type Registration | 8/81 |
| RS-311-A* | Measurement of Transistor noise Figure and Effective Input Noise Temperature at MF, HF, and VHF | 11/81, Reaffirmed 4/99 |
| RS-323* | Air-Convection-Cooled Life Test Environment for Lead-Mounted Semiconductor Devices | 3/66, Reaffirmed 2/72 |
| RS-353* | The Measurement of Transistor Noise Figure at Frequencies Up to 20 kHz By Sinusoidal Signal-Generator Method | 4/68, Reaffirmed 4/99 |
| RS-371* | The Measurement of Small-Signal VHF-UHF Transistor Short-Circuit Forward Current Transfer Ratio | 2/70, Reaffirmed 4/81 |
| RS-372* | The Measurement of Small-Signal VHF-UHF Transistor Admittance Parameters | 5/70, Reaffirmed 4/81 |
| RS-390-A* | Standard Test Procedure for Noise Margin Measurements forSemiconductor Logic Gating Microcircuits | 2/81 |
| RS-435* | Standard for the Measurement of Small-Signal Transistor Scattering Parameters | 4/76 |
| EIA-557-A | Statistical Process Control Systems | 7/95 |
| EIA-599-A | National Electronic Process Certification Standard | 6/98 |
* Older EIA standards were identified by the prefix “RS”. While they may still carry that designation on their covers, they are sometimes redesignated (e.g., on the JEDEC Web site) with the prefix “EIA” instead of the prefix “RS”.
| JIG101† | Material Composition Declaration for Electronic Products | 5/05 |
| IPC/JEDEC-9702 | Monotonic Bend Characterization of Board-Level Interconnects | 6/04 |
| J-STD-002B | Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires | 2/03 |
| J-STD-033B† | Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices | 10/05 |
| J-STD-035 | Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components | 5/99 |
| JEP962 | Guidelines for Nondestructive Pull Testing of Wire Bonds on Hybrid Devices | 3/77, Reaffirmed 3/82, Rescinded 4/00 |
| JEP119A | A Procedure for Executing SWEAT | 8/03 |
| JEP121A† | Requirements for Microelectronic Screening and Test Optimization | 10/06 |
| JEP122C† | Failure Mechanisms and Models for Semiconductor Devices | 3/06 |
| JEP123 | Guideline for Measurement of Electronic Package Inductance and Capacitance Model Parameters | 10/95 |
| JEP131A† | Process Failure Mode and Effects Analysis (FMEA) | 5/05 |
| JEP132 | Process Characterization Guideline | 7/98 |
| JEP133B | Guide for the Production and Acquisition of Radiation-Hardness Assured Multichip Modules and Hybrid Microcircuits | 3/05 |
| JEP134 | Guidelines for Preparing Customer-Supplied Background Information Relating to a Semiconductor-Device Failure Analysis | 9/98 |
| JEP136 | Signature Analysis | 7/99 |
| JEP138 | User Guidelines for IR Thermal Imaging Determination of Die Temperature | 9/99 |
| JEP140 | Beaded Thermocouple Temperature Measurement of Semiconductor Packages | 6/02 |
| JEP143A | Solid State Reliability Assessment and Qualification Methodologies | 5/04 |
| JEP146 | Guidelines for Supplier Performance Rating | 6/03 |
| JEP148 | Reliability Qualification of Semiconductor Devices Based on Physics of Failure Risk and Opportunity Assessment | 4/04 |
| JEP149† | Application Thermal Derating Methodologies | 11/04 |
| JEP150† | Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface-Mount Components | 5/05 |
| JESD4 | Definition of External Clearance and Creepage Distances of Discrete Semiconductor Packages for Thyristors and Rectifier Diodes | 11/83, Reaffirmed 1/91 |
| JESD7-A | Standard for Description of 54/74HC and 54/74HCT High-Speed CMOS Devices | 8/86 |
| JESD10 | Low-Frequency Power Transistors | 1/76, Reaffirmed 9/81 |
| JESD12-1B | Terms and Definitions for Gate Arrays and Cell-Based Digital ICs | 8/93 |
| JESD12-4 | Method of Specification of Performance Parameters for CMOS Semicustom ICs | 4/87 |
| JESD13-B | Standard Specification for Description of ‘B’ Series CMOS Devices | 5/80 |
| JESD14 | Semiconductor Power Control Modules | 11/86, Reaffirmed 6/92 |
| JESD16-A | Assessment of Average Outgoing Quality Levels in Parts per Million (PPM) | 4/95 |
| JESD18-A | Standard for Description of Fast CMOS TTL-Compatible Logic | 1/93 |
| JESD21-C | Configurations for Solid State Memories | 9/91 |
| JESD22-A105C | Power and Temperature Cycling | 1/04 |
| JESD22-A108C† | Temperature, Bias, and Operating Life | 6/05 |
| JESD22-A109-A | Hermeticity | 7/01 |
| JESD22-A117A† | Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test | 3/06 |
| JESD22-A121.01† | Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes | 10/05 |
| JESD22-B101A† | External Visual | 10/04 |
| JESD22-B103B | Vibration, Variable Frequency | 6/02 |
| JESD22-B104C† | Mechanical Shock | 11/04 |
| JESD22-B108A | Coplanarity Test for Surface-Mount Semiconductor Devices | 1/03 |
| JESD22-B109 | Flip Chip Tensile Pull | 6/02 |
| JESD22-B110A† | Subassembly Mechanical Shock | 11/05 |
| JESD22-B111 | Board Level Drop Test Method of Components for Handheld Electronic Products | 7/03 |
| JESD22-B112† | High-Temperature Package Warpage Measurement Methodology | 5/05 |
| JESD22-B113† | Board-Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products | 3/06 |
| JESD22-B116 | Wire Bond Shear Test | 7/98 |
| JESD22-B117A† | BGA Ball Shear | 10/07 |
| JESD22-C101C | Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components | 12/04 |
| JESD24 | Power MOSFETs | 7/85 |
| JESD24-1 | Method for Measurement of Power Device Turn-Off Switching Loss | 9/89 |
| JESD24-2 | Gate Charge Test Method | 1/91 |
| JESD24-3 | Thermal Impedance Measurements for Vertical Power MOSFETs (Delta Source-Drain Voltage Method) | 11/90 |
| JESD24-4 | Thermal Impedance Measurements for Biploar Transistors (Delta Base-Emitter Voltage Method) | 11/90 |
† This publication was not referenced in previous editions of JESD88 or is a revised edition of a publication that was referenced.