Global Standards for the Microelectronics Industry
Dictionary: JESD88
"A" limit
The more positive (less negative) limit of a range of some quantity.
References:JESD99B, 5/07
"B" limit
The less positive (more negative) limit of a range of some quantity.
References:JESD99B, 5/07
0-state
The logic state represented by the binary number 0 and usually standing for an inactive or false logic condition. (Ref. ANSI/IEEE Std 91.)
References:JESD99B, 5/07
1-state
The logic state represented by the binary number 1 and usually standing for an active or true logic condition. (Ref. ANSI/IEEE Std 91.)
References:JESD99B, 5/07
2-D code label (matrix)
A label that contains data in two dimensions as either stack or matrix types.NOTE This was originally published as “2D code label (matrix)”.
References: J-STD-609, 5/072-D code label (matrix)
A label that contains data in two dimensions as either stack or matrix types.NOTE This was originally published as “2D code label (matrix)”.
References: J-STD-609, 5/072nd level interconnect
The interconnection made by the attachment of the device or component to the printed circuit board.
References:JESD97, 5/04
2nd level interconnect label
A label that identifies boxes, bags, or containers that contain boards, assemblies, or components having or capable of providing Pb-free 2nd‑level interconnects.
NOTE This label includes the Pb-free category and maximum processing temperature.
References:JESD97, 5/04
2nd level interconnect terminal finish/material
The material at the component 2nd level termination.NOTE Depending on the component type, this material could refer to the terminal finish or ball material.
References: J-STD-609, 5/07A
See "port A; port B".
References:A(n)
See "address inputs".
References:A-mode
See "acoustic data, A-mode"
References:A; a
See "anode terminal".
References:ABD
See “avalanche breakdown diode”. References:ABD array
A device having three or more terminals and containing multiple diodes within a single package, with at least one of the diodes being an ABD.NOTE ABD arrays can be classified as 1) devices with multiple discrete semiconductor chips; and 2) devices with multiple diode junctions diffused into a single semiconductor chip.
References: JESD77C, 10/09JESD210, 12/07
absolute maximum rated junction temperature
The maximum junction temperature of an operating device, beyond which damage (latent or otherwise) may occur.
References:JESD22-A108C, 6/05
absolute maximum rated temperature
The maximum junction or ambient temperature of an operating device as listed in its data sheet and beyond which damage (latent or otherwise) may occur.
NOTE Manufacturers may also specify maximum case temperatures for specific packages.
References:JESD89-3, 9/05
absolute maximum rated voltage
The maximum voltage that may be applied to a device, beyond which damage (latent or otherwise) may occur.
References:JESD22-A108C, 6/05
JESD89-1, 6/04
JESD89-2, 11/04
JESD89-3, 9/05