Global Standards for the Microelectronics Industry
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Displaying 1 - 2 of 2 documents.
| Title | Document # | Date |
|---|---|---|
Design Requirements - Fine Pitch Ball Grid Array Package (FBGA). (Covers body sizes >21mm) |
DR-4.27D | Mar 2017 |
Item 11.2-937. (For body sizes ≤ 21mm see Design Registration 4.5) Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Fine Pitch/Fine Pitch Interstitial Ball Grid Array Packages (FBGA) and (FIBGA). (Covers body sizes ≤ 21 mm) |
DR-4.5L | Mar 2017 |
(For body sizes >21 mm see Design Registration 4.27) Item 11.2-937 Committee(s): JC-11.2 Free download. Registration or login required. |
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