Global Standards for the Microelectronics Industry
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| Title | Document # | Date |
|---|---|---|
GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESSStatus: ReaffirmedJune 2011 |
JEP154 | Jan 2008 |
This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis. Free download. Registration or login required. |
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