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This document provides SMD manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. Now updated to support components that may need to be processed at higher temperatures, such as lead-free processes, these methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. IPC/JEDEC J-STD-033C helps achieve safe and damage-free reflow with the dry packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags.

NOTE - Figure 3-2, Humidity Indicator Card (HIC) has been editorially revised (Removed "Initial Use" from lable) since originally posted January 2012, if you downloaded this file prior to February 8, 2013 please download this revised version.

Committee(s): JC-14, JC-14.1

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