Year in Review: 2014

Thousands of dedicated volunteers representing nearly 300 member companies helped JEDEC serve the industry in 2014, and contributed to a year filled with both new and ongoing initiatives:

Standards and Publications

JEDEC continued to develop important new industry standards and publications in the areas of memory, packaging, quality and reliability, thermal standardization, electronic sensitivity and electrical interface. In 2014, JEDEC published 14 complete standards, 6 publications, 2 joint standards, 13 registered outlines, 3 design registrations, and 13 memory device specifications, including the following:

  • JESD209-4, Low Power Double Data Rate 4 (LPDDR4)
  • JESD229-2, Wide IO 2 (WideIO2)
  • JESD237, Reliability Qualification of Power Amplifier Modules
  • JESD246, Customer Notification Process for Disasters
  • JEP171, GDDR5 Measurement Procedures

JEDEC also published the following notable updates to previously existing standards:

  • JESD8-22B, HSUL_12 LPDDR2 and LPDDR3 I/O with Optional ODT
  • JESD84-B50.1, Embedded Multi-media Card (e•MMC) Electrical Standard (5.01)
  • JESD230B, NAND Flash Interface Interoperability
  • JEP153A, Characterization and Monitoring of Thermal Stress Test Oven Temperatures
  • JP001A, Foundry Process Qualification Guidelines
  • SO-017C, DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch

President’s Update

JEDEC’s president was invited to offer expertise and insight on the topic of Standard Essential Patents (SEPs) in various forums during the past year, including a seminar in September for visiting government officials from China hosted by the U.S. Trade Development Administration and the U.S. Trade Representative.  He and the Director of Marketing also initiated a new strategic relationship with another major trade organization representing the semiconductor industry, and worked with a consultant to evaluate possible new areas of standards development for JEDEC.

Events

JEDEC hosted several successful events this year.  Mobile Forums and LPDDR4 Workshops were held in several locations including Las Vegas, NV during the 2014 International Consumer Electronics Show; and in Hsinchu, Taiwan; Seoul, Korea and Santa Clara, California. The events in Taiwan and Korea were held in partnership with the Taiwan Semiconductor Industry Association and the Korea Semiconductor Industry Association, respectively. JEDEC also held the 29th Annual Reliability of Compound Semiconductors (ROCS) Workshop in Denver, CO in May, and a Server Forum in Santa Clara, CA in October. 

China Office

Due to the ongoing maturation of China's semiconductor market and a focused effort on membership development, JEDEC has seen an increase in new member companies from China in 2014. The China Office continued to offer support to members in China by advising them on participating in the JEDEC process.  As a result, there have been more participants from Chinese member companies attending JEDEC committee meetings and events.  The office provided additional local support, including responding to 45 technical inquiries and assisting with processing orders for JEDEC Manufacturer’s ID codes.  With the Chinese government stepping up its policy and monetary support for the development of the semiconductor industry, JEDEC membership in China is poised for further steady growth.

Marketing and Communications

The Marketing and Communications Department was very active this year in the promotion of JEDEC’s events and major standards announcements, resulting in prominent coverage in major industry publications. The department also continued a partnership with SmartBrief to ensure the continued popularity of the JEDEC SmartBrief daily email newsletter, providing increased awareness for the JEDEC brand, standards and ongoing activities. Subscribe today. 

Committee Growth

The JC-13 Government Liaison Committee formed a subcommittee focused on evaluating new and emerging electronic device technologies for potential future insertion in military, aerospace and other special use applications. The JC-13.7 Subcommittee for New Electronic Device Technology welcomes interested companies worldwide to participate by joining JEDEC.

Industry Collaboration

During the past year JEDEC maintained existing liaisons and developed new partnerships. Such collaboration is vital to the industry and helps avoid duplicative standards development efforts. Key activities include:

  • CEA: JEDEC continued to participate in the International Consumer Electronics Show (CES) as an Allied Association Partner sponsor of the Digital Patriots Dinner.
  • DLA: JEDEC continued its collaboration with the Defense Logistics Agency (DLA).  The triad of JEDEC/SAE/DLA brings together the perspectives of the manufacturers, suppliers and government to update pertinent military standards including MIL-STD-750, MIL-STD-883, MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535.
  • ESDA: JEDEC and ESDA recently published the latest version of their joint HBM ESD standard JS-001-2014. A companion user guide was developed. Balloting in both organizations took place on the joint CDM standard in 2014 and the document is nearing completion now.
  • GSA: Cooperation continued with GSA on the revision of JP001A: Foundry Process Qualification Guidelines, which was published on March 3, 2014.
  • IPC: JEDEC continued its collaboration with IPC on J-STD-020 and next revision of this standard will be published in the near future. IPC/JEDEC-9703 ”Solder Joint Reliability in Shock Conditions” was reaffirmed in 2014. IPC/JEDEC-9702 “Monotonic Bend Characterization in Board Level Interconnects” was revised in 2014.
  • JEITA: JEDEC and JEITA held a joint meeting in Vancouver in September 2014 to continue their standards harmonization efforts.
  • MIPI® Alliance: JEDEC’s UFS standard continues to reference the latest versions of both the MIPI M-PHY® and UniProSM specifications.
  • ONFI: JEDEC published an update with ONFI to JESD230: NAND Flash Interoperability.
  • SAE: JEDEC continued a partnership with SAE that began in 2013 after the acquisition by SAE of the G-11 and G-12 Committees from TechAmerica.
  • SIA: JEDEC served as an association sponsor of the Semiconductor Industry Association's Annual Awards Dinner.

Past Years

Member Thank You

JEDEC is grateful for your active participation and support of open industry standards and the standards development process.
JEDEC is committed to serving you, your company and the industry. If you have any questions about your membership or need assistance, please contact Ms. Arlene Collier at (703) 907-7534 or arlenec@jedec.org.

Resources (handouts)

In response to member requests, JEDEC has created the following resources to help explain the value of open industry standards and JEDEC participation:

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